Pin-to-Pin Compatible with WG7837-V0 (TI WL1837MOD)
The WG7A0x-01 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC to provide the best WiFi and BLE coexistence interoperability and power saving technologies from TI.
The WG7A0x-01 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART.
Linux and Android drivers are provided for a wide range of application processors.
Highly optimized Wi-Fi 6 and BLE 5.3 system for low cost embedded IoT applications
Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
MAC, Baseband and RF Transceiver with support for IEEE 802.11 b/g/n/ax Wi-Fi6
Bluetooth® Low Energy 5.3
External coex interface to connect to Thread/Zigbee radio
Application throughput up to 50 Mbps
Supplied on 1800 pieces tape and reel
CHIPSET
CC3300/CC3301
WLAN
IEEE 802.11 a/b/g/n/ax Wi-Fi6 & BLE 5.3
Certification
CE/FCC/IC/TELEC (Planned)
Dimension
13.4mm (L) x 13.3mm (W) x 2.0mm (H)
Operating Temperature
Temperature: -40~85° C
Interface
SDIO/UART
2.4 GHz Wi-Fi 6 BLE 5.3 SIP Module for Industrial IoT
