The WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI.

The WG7837V0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART. 

Linux and Android drivers are provided for a wide range of application processors.

Key Features

Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives and power management

LGA100 pin package

Dimension 13.3 x 13.4 x 2.0 mm

FCC, IC, ETSI/CE, and TELEC certified with chip antennas

WLAN baseband processor and RF transceiver supporting IEEE 802.11 a/b/g/n

4-Bit SDIO host interface support

Supports Bluetooth core specification version 5.1

Host Controller Interface (HCI) transport for Bluetooth over UART

Dual-Mode Bluetooth and Bluetooth LE

Wi-Fi-Bluetooth single antenna coexistence

Operating temperature: -40°C ~ 85°C



TI WL1837


IEEE 802.11 a/b/g/n & BT 5.1


FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas

Dimension (mm)

13. 3mm x 13.4 mm x 2.0 mm

Operating Temperature

-40°C ~ 85°C





Title Version Size Download
WG7837V0-DTS-R06_230331 3.99 mb Download Preview