The WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI.
The WG7837V0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART.
Linux and Android drivers are provided for a wide range of application processors, with WinCE and Windows Mobile drivers available from our partner network.
Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives and power management
LGA100 pin package
Dimension 13.3 x 13.4 x 2.0 mm
FCC, IC, ETSI/CE, and TELEC certified with chip antennas
WLAN baseband processor and RF transceiver supporting IEEE 802.11 a/b/g/n
4-Bit SDIO host interface support
Supports Bluetooth core specification version 4.2.
Host Controller Interface (HCI) transport for Bluetooth over UART
Dual-Mode Bluetooth and Bluetooth LE
Wi-Fi-Bluetooth single antenna coexistence
Operating temperature: -40°C ~ 85°C
IEEE 802.11 a/b/g/n & BT(2.1/3.0/4.1)
FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
13. 3mm x 13.4 mm x 2.0 mm
-40°C ~ 85°C
2.4GHz WiFi & BT SiP Module