The WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI.

The WG7837V0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART. 

Linux and Android drivers are provided for a wide range of application processors, with WinCE and Windows Mobile drivers available from our partner network.

Key Features

Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives and power management

LGA100 pin package

Dimension 13.3 x 13.4 x 2.0 mm

FCC, IC, ETSI/CE, and TELEC certified with chip antennas

WLAN baseband processor and RF transceiver supporting IEEE 802.11 a/b/g/n

4-Bit SDIO host interface support

Supports Bluetooth core specification version 4.2.

Host Controller Interface (HCI) transport for Bluetooth over UART

Dual-Mode Bluetooth and Bluetooth LE

Wi-Fi-Bluetooth single antenna coexistence

Operating temperature: -40°C ~ 85°C

Specification

Chipset

TI WL1833

WLAN

IEEE 802.11 a/b/g/n & BT(2.1/3.0/4.1)

Certification

FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas

Dimension (mm)

13. 3mm x 13.4 mm x 2.0 mm

Operating Temperature

-40°C ~ 85°C

Interface

SPI

Downloads

WG7837-V0

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WG7837V0_Datasheet 1.91 mb Download Preview