WG7837-V0
2.4/5 GHz
WiFi & Bluetooth SiP Module
WG7837-V0
The WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI.
The WG7837V0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART.
Linux and Android drivers are provided for a wide range of application processors.
Key Features
Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives and power management
LGA100 pin package
Dimension 13.3 x 13.4 x 2.0 mm
FCC, IC, ETSI/CE, and TELEC certified with chip antennas
WLAN baseband processor and RF transceiver supporting IEEE 802.11 a/b/g/n
4-Bit SDIO host interface support
Supports Bluetooth core specification version 5.1
Host Controller Interface (HCI) transport for Bluetooth over UART
Dual-Mode Bluetooth and Bluetooth LE
Wi-Fi-Bluetooth single antenna coexistence
Operating temperature: -40°C ~ 85°C
Specification
Chipset
TI WL1837
WLAN
IEEE 802.11 a/b/g/n & BT 5.1
Certification
FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
Dimension (mm)
13. 3mm x 13.4 mm x 2.0 mm
Operating Temperature
-40°C ~ 85°C
Interface
SDIO/UART
Downloads
WG7837-V0
| Title | Version | Size | Download |
|---|---|---|---|
| WG7837V0-DTS-R06_230331 | 3.99 mb | Download Preview |
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