Industrial Dual Band, 2×2 MIMO Wi-Fi®, BT & BLE Module
Jorjin Technologies’ WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best Wi-Fi and BT coexistence interoperability and power saving technologies from TI.Please click here if you missed out WG7837V0’s case study last week. We will continue sharing Jorjin’s success stories and products with you. Feel free to contact us +886(2)2649-0055 or drop us an email anytime!
- Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power Management
- LGA‐100 pin package
- 13.3 x 13.4 x 2.0 mm
- FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
- Operating temp: ‐40°C to 85°C