Industrial Dual Band, 2×2 MIMO Wi-Fi®, BT & BLE Module
Jorjin Technologies’ WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best Wi-Fi and BT coexistence interoperability and power saving technologies from TI.
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- Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power Management
- LGA‐100 pin package
- 13.3 x 13.4 x 2.0 mm
- FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
- Operating temp: ‐40°C to 85°C