The WG7A01-01 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI CC3301 SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC to provide the best WiFi and BLE coexistence interoperability and power saving technologies from TI.

The WG7A01-01 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART.

Linux and Android drivers are provided for a wide range of application processors.

Key Features

Highly optimized Wi-Fi 6 and BLE 5.4 system for low cost embedded IoT applications

Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)

MAC, Baseband and RF Transceiver with support for IEEE 802.11 b/g/n/ax Wi-Fi 6

Bluetooth® Low Energy 5.4

External coexistence to connect to Thread/Zigbee radio

Application throughput up to 50 Mbps

Supplied on 1,200 pieces tape and reel

Specification

CHIPSET

TI CC3301

WLAN

IEEE 802.11 a/b/g/n/ax Wi-Fi 6 & BLE 5.4

Certification

CE/FCC/IC/TELEC (Planned)

Dimension

13.4mm (L) x 13.3mm (W) x 2.0mm (H)

Operating Temperature

Temperature: -40~85° C

Interface

SDIO/UART