WG7837-V0
2.4/5 GHz WiFi & Bluetooth SiP Module
Module
The WG7837-V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power saving technologies from TI. The WG7837V0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART. Linux and Android drivers are provided for a wide range of application processors.
Key Features
Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives and power management.
LGA100 pin package.
Dimension 13.3 x 13.4 x 2.0 mm.
FCC, IC, ETSI/CE, and TELEC certified with chip antennas.
WLAN baseband processor and RF transceiver supporting IEEE 802.11 a/b/g/n.
4-Bit SDIO host interface support.
Supports Bluetooth core specification version 5.1.
Host Controller Interface (HCI) transport for Bluetooth over UART.
Dual-Mode Bluetooth and Bluetooth LE.
Wi-Fi-Bluetooth single antenna coexistence.
Operating temperature: -40°C ~ 85°C.
Specification
Models
WG7837-V0
Chipset
TI WL1837
Wireless Standard
IEEE 802.11 a/b/g/n & BT 5.1
Frequency Bands
2.4GHz / 5GHz Dual-band
Antenna Configuration
1T1R
Module Dimentions
13.3 x 13.4 x 2.2 mm (SiP packaging)
Host Interfaces
Wi‑Fi: SDIO；Bluetooth: UART
Operating Temperature
-40°C ~ 85°C
Certifications
FCC / CE / IC / TELEC / RCM / NCC
Datasheet
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