The WG7A0x-00 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI SimpleLink™ CC330x Wi-Fi 6 and Bluetooth® Low Energy companion IC to provide the best Wi-Fi and BLE coexistence interoperability and power saving technologies from TI enable a secure IoT connection with reliable RF performance in industrial markets such as grid infrastructure, medical and building automation.

The WG7A0x-00 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART.

Linux and RTOS drivers are provided for a wide range of application processors.

Key Features

Highly optimized Wi-Fi 6 and BLE 5.3 system for low cost embedded IoT applications

Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)

MAC, Baseband and RF Transceiver with support for IEEE 802.11 b/g/n/ax Wi-Fi 6

Bluetooth® Low Energy 5.3

External coex interface to connect to Thread/Zigbee radio

Application throughput up to 50 Mbps

Package LGA-65



TI SimpleLink CC3300 (2.4GHz Wi-Fi 6 only) and CC3301 (2.4GHz Wi-Fi 6 + BLE 5.3) chips


IEEE 802.11 b/g/n/ax Wi-Fi 6 & BLE 5.3



Dimension (mm)

11 mm (L) x 10 mm (W) x 2 mm (H)

Operating Temperature

-40~85° C






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