Category Archives: News

Jorjin Introduces “Moonbear”, a Hardware Development Kit Based on Qualcomm® Snapdragon™ XR1 Platform, Aiming to Shorten the Design Cycle of Augmented Reality Products

Jorjin Technologies, a Taiwan company which started working on smart glasses years ago when Augmented Reality (AR) was still in its infancy, is introducing “Moonbear”, a Hardware Development Kit (HDK) based on the Snapdragon XR1 Platform. The Moonbear HDK is a very compelling solution for companies engaged in the design of AR Products and aiming

Jorjin and Gigabyte Join Forces to Showcase a Smart Pharmacy Solution and a New Family of AR Smart Glasses in CES 2020

With all the momentum built behind the convergence of Augmented Reality with 5G and Industry 4.0, all tech giants are gearing up to showcase new applications benefiting from those technologies. Jorjin Technologies, who started working on smart glasses when AR was still in its infancy, will be partnering with Gigabyte in this year’s CES on

Let’s countdown for CES 2020! Don’t miss out Jorjin’s smart pharmacy solution

Jorjin Technologies is glad to announce its strategic partnership with GIGABYTE for the upcoming CES 2020 at the LVCC, South Hall 1 – 20925 in Las Vegas. As a pioneer of the AR smart glasses industry, Jorjin Technologies is going to present a brand new concept of ‘smart pharmacy’ at CES 2020. By wearing J-Supporter,

Are You Ready for Sigfox Connect in Singapore on Nov. 20-21? Let’s meet at T5!

We are looking forward to seeing you at Sigfox Connect from 20th to 21st November at booth T5. Jorjin Technologies will showcase an industrial smart sensing solution including industry grade sensors, Jorjin’s Sigfox monarch module WS2116, and Exosite cloud. Jorjin’s fully packaged industrial smart sensing solution can optimize the efficiency in processing zones, freezer storage, and banquet halls, where temperature,

Have a Look at WG7837V0, Jorjin’s Industrial Dual Band, 2×2 MIMO Wi-Fi, BT & BLE Module!

WG7837V0 Industrial Dual Band, 2×2 MIMO Wi-Fi®, BT & BLE Module Jorjin Technologies’ WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best Wi-Fi and BT coexistence interoperability and power saving technologies from

Don’t Miss Out Jorjin’s most popular WG7801-X0 WiFi Module

Jorjin Technologies’ WG7801-B0 is a 2.4GHz WLAN system in package (SiP) module based on the WL1801 SoC from Texas Instruments. It contains a power amplifier, Tx filter as well as the necessary passive components to fully implement the 802.11b/g/n WiFi functions. The only difference between WG7801-B0 and WG7801-D0 is the operating temperature that WG7801-B0 supports

Jorjin Presents the WiLink8 WG78XX Family and 802.11ac & BT5.0 Module WG3221 for CPU

Jorjin Technologies is known for the high performance and quality of its wireless connectivity modules, especially for the WiLink8 WG78XX product line, with the new 802.11ac & BT5.0 module WG3221 being popular immediately since launch. The WiLink8 WG78XX family includes the modules WG7801-B0/D0, WG7831-B0/D0, WG7833-B0, and WG7837V0, supporting both consumer and industrial temperatures and fully

Jorjin Showcases Smart Glasses at 2019 New Taipei City International Trade Fair

Jorjin Technologies was invited to the 2019 New Taipei City International Trade Fair from 25th to 26th September. It is our honor that New Taipei City Mayor Hou, You-Yi tried Jorjin’s J-supporter smart glass after the opening ceremony. Smart glasses seem to be a new concept to most of people, and Mayor Hou suggests that

Jorjin Announces High Performance, Low Power Single-stream 11ac MU-MIMO & Bluetooth 5 EVB WG3221E00

The WG3221-00 is a wireless local area network (WLAN) and Bluetooth (BT) combination module to support 1×1 IEEE 802.11a/b/g/n/ac WLAN standards and BT5.0, enabling seamless integration of WLAN/BT and low-energy technology. This module is design based on Qualcomm QCA9377-3 single-die chip. WG3221-00 is designed to provide high-speed Wi-Fi and Bluetooth connectivity to application processors. Developers can