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2.4/5 GHz WiFi & Bluetooth SiP Module
IEEE 802.11a,b,g,n​ + BT(2.1/3.0/4.1)
Key Features
  • WLAN, Bluetooth, BLE with Integrated RF Front-End Module (FEM), Power Amplifier (PA),
  • and Power Management on a Single Module.
  • LGA106 pin package.
  • Dimension 12.8mm(L) x 12.0mm(W) x 1.63mm(H)
  • Provides efficient direct connection to battery by employing several integrated switched mode
  • power supplies (DC2DC).
  • Seamless Integration with TI Sitara™ and Other Application Processors
  • WLAN and BT/BLE cores are software and hardware compatible with prior WL127x and WL128x
  • offerings, for smooth migration to device.
  • Shared HCI transport for BT/BLE over UART and SDIO for WLAN.
  • Temperature detection and compensation mechanism ensures minimal variation in RF
  • performance over the entire temperature range.
  • BT 4.1, BLE and all audio processing features work in parallel and include full coexistence with
  • WLAN
  • Operating temperature: –40°C to 85°C
The Jorjin WG7833-B0 is a low cost 2.4/5 GHz WLAN + Bluetooth system in package (SiP) module based on the WL1833 SoC from Texas Instruments.  It contains a crystal, power amplifier, Tx filter and Tx/Rx switch as well as the necessary passive components to fully implement the 802.11a,b,g,n WiFi & Bluetooth 4.1 functions.

The WG7833-B0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART.  Linux and Android drivers are provided for a wide range of application processors.
WG78xx module Porting Guide For iMX8 and Android 8
WG78xx module Porting Guide for i.MX6Q SABRE-Auto Android_N7.1.1_1.0.0
WG78xx module Porting Guide For Renesas-RZG1M and linux3.10
WG78xx module Porting Guide For iMX7 and Linux kernel 4.1.15
WG78xx module Porting Guide For iMX6 and Android 6
HW Platform and OS Support Note For WG78xx module